NTTFS4840N
Power MOSFET
30 V, 26 A, Single N ? Channel, m 8FL
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? DC ? DC Converters
? Point of Load
? Power Load Switch
? Notebook Battery Management
? Motor Control
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) MAX
24 m W @ 10 V
36 m W @ 4.5 V
N ? Channel MOSFET
D (5 ? 8)
I D MAX
26 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
30
Unit
V
Gate ? to ? Source Voltage
V GS
± 20
V
G (4)
Continuous Drain
Current R q JA (Note 1)
T A = 25 ° C
T A = 85 ° C
I D
7.3
5.3
A
S (1,2,3)
S
D
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JA ≤ 10 s
(Note 1)
Power Dissipation
R q JA ≤ 10 s (Note 1)
Continuous Drain
Current R q JA (Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JC (Note 1)
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T C = 25 ° C
T C = 85 ° C
P D
I D
P D
I D
P D
I D
2.2
10.3
7.5
4.4
4.6
3.3
0.84
26
19
W
A
W
A
W
A
MARKING DIAGRAM
1
1
WDFN8 S 4840 D
( m 8FL) S AYWW G D
CASE 511AB G G D
4840 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
Power Dissipation T C = 25 ° C
R q JC (Note 1)
Pulsed Drain Current T A = 25 ° C, t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
P D
I DM
T J ,
T stg
I S
27.8
77
? 55 to
+150
23
W
A
° C
A
ORDERING INFORMATION
Device Package Shipping ?
NTTFS4840NTAG WDFN8 1500/Tape & Reel
(Pb ? Free)
Drain to Source dV/dt
dV/dt
6.0
V/ns
NTTFS4840NTWG
WDFN8
5000/Tape & Reel
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L = 18.3 A pk , L = 0.1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
E AS
T L
16.7
260
mJ
° C
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 sq ? in pad, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2011
January, 2011 ? Rev. 1
1
Publication Order Number:
NTTFS4840N/D
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